| PART |
Description |
Maker |
| 35730-7200 0357307200 |
3.56mm (.140) Diameter Pin Terminal, Brass, 0.50mm (.020) Thickness, Wire Range 14-20 AWG (2.00-0.52mm2), 15.50mm (.610) Pitch, Unplated
|
Molex Electronics Ltd.
|
| HEDS-6500-A05 HEDS-6500-A10 HEDS-6500-A11 HEDS-650 |
HEDS-6510#005 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6505#B05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6500#A05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6500#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6505#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6545#B09 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6540#B11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6540#T11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
Large Diameter (56 mm), Housed Two and Three Channel Optical Enco
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| HEDM-65XX |
Large Diameter (56mm),Housed Two and Three Channel Optical Encoders(大的直径(56mm),含有两个和三个通道的光编码
|
Agilent(Hewlett-Packard)
|
| 0440671003 44067-1003 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-0802 0440670802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
|
Molex Electronics Ltd.
|
| 44067-0402 0440670402 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| 0440672403 44067-2403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0440672002 44067-2002 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 461-2633 |
Eyelet mount connector pin, .040 (1,02) diameter pin
|
CAMBION Electronic Components
|
| 461-2654 |
Eyelet mount connector pin, .044 (1,14) diameter pin
|
CAMBION Electronic Components
|
|
